Draft:Electronic Components and Technology Conference
 | This article, Draft:Electronic Components and Technology Conference, has recently been created via the Articles for creation process. Please check to see if the reviewer has accidentally left this template after accepting the draft and take appropriate action as necessary.
Reviewer tools: Preload talk Inform author |
 | This article has multiple issues. Please help improve it or discuss these issues on the talk page. (Learn how and when to remove these messages)
|
The IEEE Electronic Components and Technology Conference[1] is an annual semiconductor-industry conference for reporting technological breakthroughs in advanced chip packaging and components. The technical program covers a broad range of topics, including heterogeneous and 2.5D/3D integration, interconnect technology, wafer-level packaging, hybrid bonding, photonics, materials and reliability, among others.[2]
It is sponsored by the Electronics Packaging Society[3] of the Institute of Electrical and Electronics Engineers (IEEE).[4]
Advanced packaging is playing an increasingly important role in the semiconductor industry, because it opens up new ways to build highly complex and powerful systems as traditional chip miniaturization according to Moore's Law becomes more difficult and costly.[5]
The 74th annual ECTC conference will be held May 28–31, 2024 at the Gaylord Rockies Resort & Convention Center in Denver, CO. The keynote talk will be given by Professor Keren Bergman of Columbia Universityhttps://www.ee.columbia.edu/keren-bergman, on petascale photonic chip connectivity for energy-efficient AI computing.
References
- ^ "ECTC | IEEE Electronic Components and Technology Conference". Electronic Components and Technology Conference. Retrieved 2024-04-29.
- ^ LaPedus, Mark (2019-06-10). "ECTC: IC Packaging in Vegas". Semiconductor Engineering. Retrieved 2024-04-29.
- ^ "Home". IEEE Electronics Packaging Society. Retrieved 2024-04-29.
- ^ "Home". IEEE. Retrieved 2024-04-29.
- ^ "Beyond Moore's Law – Enabling Heterogeneous Integration and Next Generation Chiplet Architectures". IPC International, Inc. 2022-08-31. Retrieved 2024-04-29.