File:Wirebonding2.svg

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Description
English: A sketch diagram of the wedge-bond wirebonding in a power transistor in a package such as a D2PAK. The copper tab forms the drain connection, as is exposed in the finished product. This whole assembly is held in a rigid, insulating material. The aluminium wires are generally around 250 to 400 µm thick.
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Author Inductiveload
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attribution share alike
This file is licensed under the Creative Commons Attribution-Share Alike 2.5 Generic, 2.0 Generic and 1.0 Generic license.
You are free:
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Derivative works of this file:  Wirebonding2 DE.svg

Based on Wirebonding.svg by Cyril Buttay.

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19 November 2008

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Date/TimeThumbnailDimensionsUserComment
current08:08, 19 November 2008Thumbnail for version as of 08:08, 19 November 2008600 × 300 (21 KB)wikimediacommons>InductiveloadSomething odd is going on here. Sorry for any duplicate uploads.

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